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MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2700MHz
Downconversion Mixer with LO Buffer/Switch
ABSOLUTE MAXIMUM RATINGS
V CC ........................................................................-0.3V to +5.5V
LO1, LO2 to GND ...............................................................±0.3V
IFM_, IFD_, IFM_SET, IFD_SET, LOSEL,
LO_ADJ_M, LO_ADJ_D to GND.............-0.3V to (V CC + 0.3V)
RFMAIN, RFDIV, and LO_ Input Power ..........................+20dBm
RFMAIN, RFDIV Current
Continuous Power Dissipation (Note 1) .............................6.75W
Operating Temperature Range (Note 2) ...T C = -40°C to +100°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
(RF is DC shorted to GND through balun) ......................50mA
Note 1: Based on junction temperature T J = T C + ( θ JC x V CC x I CC ). This formula can be used when the temperature of the exposed
pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction
temperature must not exceed +150°C.
Note 2: T C is the temperature on the exposed pad of the package. T A is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS
TQFN
Junction-to-Ambient Thermal Resistance ( θ JA )
Junction-to-Case Thermal Resistance ( θ JC )
(Note 1, 4) ...................................................................7.4°C/W
(Note 3, 4) ....................................................................38°C/W
Junction-to-Board Thermal Resistance ( θ JB )................12.2°C/W
Note 3: Junction temperature T J = T A + ( θ J A x V CC x I CC ). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150°C.
Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial .
DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, no input RF or LO signals applied, V CC = 4.75V to 5.25V, T C = -40°C to +85°C. Typical values are at V CC
= 5.0V, T C = +25°C, unless otherwise noted.)
PARAMETER
Supply Voltage
SYMBOL
V CC
CONDITIONS
MIN
4.75
TYP
5
MAX
5.25
UNITS
V
Total supply current
V CC (pin 16)
332
82
380
90
Supply Current
I CC
V CC (pin 30)
97
110
mA
IFM+/IFM- (total of both)
IFD+/IFD- (total of both)
70
70
90
90
LOSEL Input High Voltage
LOSEL Input Low Voltage
V IH
V IL
2
0.8
V
V
LOSEL Input Current
I IL and I IH
-10
+10
μA
RECOMMENDED AC OPERATING CONDITIONS
PARAMETER
RF Frequency Range
LO Frequency Range
IF Frequency Range
LO Drive Level
SYMBOL
f RF
f LO
f IF
P LO
(Note 5)
(Note 5)
(Note 5)
(Note 5)
CONDITIONS
MIN
1700
1400
40
-3
TYP
MAX
2700
2600
350
+3
UNITS
MHz
MHz
MHz
dBm
2
Maxim Integrated
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